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eMMC 5.1 Interface : Boot, RPMB HS400, Field Firmware Update, Power Off Notification, Device Report etc.Enhanced Strobe feature Full backward compatibility with previous Multimedia Card system specification Error free memory access Write Leveling High reliability of MLC NAND Packages: 153-ball BGA (Small Package Available) Long-term support
Density | Stack | Type | Vcc | Option | Package Type | Part Number | Status |
---|---|---|---|---|---|---|---|
4GB | 1-stack | MLC | 3.3V | eMMC 5.0 | 153B (8.0mm X 10mm) | JSMC04AUA1HYAED-H4 | Contact us |
4GB | 1-stack | MLC | 3.3V | eMMC 5.0 | 153B (8.0mm X 10mm) | JSMC04AUA1HYAED-H4I | M/P |
4GB | 1-stack | MLC | 3.3V | eMMC 5.1 | 153B (11.5mm x 13 mm) | JSMC04AUM1ASAEA-H5 | Sample Q2Y20 |
8GB | 1-stack | MLC | 3.3V | eMMC 5.1 | 153B (11.5mm x 13 mm) | JSMC08AUD1AYAEA-H4 | Sample Now |
8GB | 1-stack | MLC | 3.3V | eMMC 5.1 | 153B (11.5mm x 13 mm) | JSMC08AUA2ASAEA-H5 | Sample Q2Y20 |